AnyLayer PCB (M-VIA Ⅲ)
These are PCBs that enable free connection between all layers combining laser technology and filled plating technology that allows ultra-fine processing. With the higher degree of design freedom and higher-density wiring, these PCBs are ideal for the needs of downsizing and thinning of smartphones and other high performance devices.
Features
- AnyLayer PCBs with Laser Via and Filled Plating on each layer
- Thinner 0.4mm pitch CSP by AnyLayer interconnection supported
- Mass-production of 10-layer M-VIA Ⅲ (AnyLayer PCBs) for mobile devices
Applications
- Smartphones
- Wearable devices
- Digital cameras
- Digital video cameras
- Small mobile devices, etc.
Cross section
Stackup
Design rule
| Parameter | Symbol | Standard Spec | Min Spec | ||
|---|---|---|---|---|---|
| Line width/Spacing | HDI Layer | A / A' | 75 / 75 | 50 / 50 | |
| Plated Through Hole | Drill Diameter | B | 300 | 250 | |
| Pad Diameter | Outer Layer | C | 550 | 450 | |
| Inner Layer | D | 600 | 500 | ||
| Laser Via | Via Diameter | E | 100 | 75 | |
| Pad Diameter | F | 250 | 220 | ||
| Dielectric thickness | HDI Layer | G | 60 | 40 | |
| Core Layer | H | 60 | 50 | ||
| PCB Thickness | 6-layer | I | 440 | ||
| 8-layer | 590 | ||||
| 10-layer | 740 | ||||
- These figures are merely settings. They are subject to change without notice.
