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Telecommunications

Module

AnyLayer PCB (M-VIA Ⅲ)

AnyLayer PCB with Laser Via and Filled Plating on each layer, it is possible to build thin construction and 0.4mm pitch CSP by AnyLayer interconnection.
Embedded Devices PCB

Meiko has been developing a connection process using laser via and plating in addition to a bonding process using solder materials.

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