High Layer Count PCB
Taking advantage of our total strength in PCB manufacturing, Meiko provides low-cost and high-reliability high layer count PCBs from our domestic and overseas production bases in a timely manner. By supporting the fine pitch with the technology of high alignment accuracy as well as applying multi-stacked HDI technology using laser via and filled plating, Meiko realizes the multi-layer substrate structure with the high degree of wiring freedom. In addition, Meiko achieves reduction in the number of layers and cost by offers tailored to customers from PCB design to implementation.
Features
- High-density implementation supported
- High-speed communication supported by low-loss materials
Applications
- Communication base station network devices
- High-speed and large-capacity optical fiber devices
- Communication devices
- Measurement devices
- Computer peripherals
- Medical devices
Cross section
Design rule
| Parameter | Standard Spec |
|---|---|
| Max. layer count | 22-layer |
| HDI stack | 3 |
| Board thickness | 3.0mm |
| Max work panel size | 535mm × 610mm |
| Aspect ratio | 12：1 |
| L/S | 0.07/0.07mm |
| Surface finish | OSP, ENIG, hard gold |
| Material | FR-4, FR-5, HF, Low/Mid loss |
- These figures are merely settings. They are subject to change without notice.
