HDI PCB (M-VIA Ⅰ/Ⅱ)
AnyLayer PCB (M-VIA Ⅲ)
High Layer Count PCB
Heavy Copper PCB
Metal Base Heat Dissipation PCB
Embedded Devices PCB
High Frequency Millimeter-wave PCB
Copper Inlay PCB
Message from the President
R & D
To individual Investors
Meiko's Approach to CSR
Note at the time of the inquiry
The reply to inquiries, please understand that it may not be a clear answer or your time by its content and timing. In addition, the reply mail, or reprint a portion or all of our without permission e-mail, please refrain from taking advantage of the secondary.
The latest notice concerning the performance is posted.
Information regarding performance highlights, key financial indicators, and order statistics by quarter.
Gathered information to help you understand more about Meiko.
Various IR documents, such as Financial Statements and Annual Reports, etc..
Past accomplishments and planned IR activities.
Basic information regarding stocks and shareholders' meetings.
Frequently asked questions about our business performance and stocks.
Basic policies and standards concerning information disclosure are posted.
Notice points when using this site are listed.