Automotive
ITS (Navigation, etc.)
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HDI PCB (M-VIA Ⅰ/Ⅱ)
HDI PCB is composed of Staggered Via and Stacked Vias. Laser Via hole, IVH and Plated Through Hole are used in combination.
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AnyLayer PCB (M-VIA Ⅲ)
AnyLayer PCB with Laser Via and Filled Plating on each layer, it is possible to build thin construction and 0.4mm pitch CSP by AnyLayer interconnection.
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Double-sided/Multi-Layer PCB
Multi-layer through-hole PCB is used for a wide variety of applications from special products to general usage.
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FPC
FPC (flexible printed circuits) is also known as a flexible PCB. It is excellent thinness, lightness, softness and durability using insulating film as a material.