HDI PCB (M-VIA Ⅰ/Ⅱ)
These are multi-layer PCBs in which layers are piled up one by one using laser technology and plating technology after forming a conductor pattern on an insulating layer. Because wiring is possible on the connection part of each layer, this method achieves higher density and higher integration than ordinary multi-layer through-hole PCBs. They are used for devices that require high-density wiring in a limited space.
Features
- HDI PCBs with Staggered Via and Stacked Via
- Any combination with Laser Via, IVH or Plated Through Hole is possible
Applications
- Cellular phones
- Small mobile devices
- Car navigation systems
- Digital cameras
- Digital video cameras
- Multi-function printers, etc.
Cross section
Stackup
Design rule
| Parameter | Symbol | Standard Spec | Min Spec | ||
|---|---|---|---|---|---|
| Line width/Spacing | HDI Layer | A / A' | 75 / 75 | 50 / 50 | |
| Core Layer | B / B' | 75 / 75 | 50 / 50 | ||
| Plated Through Hole | Drill Diameter | C | 300 | 250 | |
| Pad Diameter | Outer Layer | D | 550 | 450 | |
| Inner Layer | E | 600 | 500 | ||
| IVH | Drill Diameter | F | 250 | 200 | |
| Pad Diameter | Outer Layer | G | 500 | 400 | |
| Inner Layer | H | 500 | 450 | ||
| Laser Via | Via Diameter | I | 100 | 75 | |
| Pad Diameter | J | 250 | 220 | ||
| Dielectric Thickness | HDI Layer | K | 60 | 40 | |
| Core Layer | L | 100 | 60 | ||
- These figures are merely settings. They are subject to change without notice.
Related products
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AnyLayer PCB (M-VIA Ⅲ)
AnyLayer PCB with Laser Via and Filled Plating on each layer, it is possible to build thin construction and 0.4mm pitch CSP by AnyLayer interconnection.
-
Double-sided/Multi-Layer PCB
Multi-layer through-hole PCB is used for a wide variety of applications from special products to general usage.