Industrial equipment

Medical equipment

• 

  HDI PCB (M-VIA Ⅰ/Ⅱ)

  HDI PCB is composed of Staggered Via and Stacked Vias. Laser Via hole, IVH and Plated Through Hole are used in combination.

• 

  AnyLayer PCB (M-VIA Ⅲ)

  AnyLayer PCB with Laser Via and Filled Plating on each layer, it is possible to build thin construction and 0.4mm pitch CSP by AnyLayer interconnection.

• 

  Embedded Devices PCB

  Meiko has been developing a connection process using laser via and plating in addition to a bonding process using solder materials.

• 

  FPC

  FPC (flexible printed circuits) is also known as a flexible PCB. It is excellent thinness, lightness, softness and durability using insulating film as a material.

• 

  FR4-FLEX/M-VIA Flex®

  FR4-FLEX/M-VIA Flex® is rigid-flex PCB without polyimide that can be utilized for applications that do not require repeated bending and as an alternative to connectors.

• 

  Double-sided/Multi-Layer PCB

  Multi-layer through-hole PCB is used for a wide variety of applications from special products to general usage.