What was the background to your decision to enter the package substrate market?
A.
Due to the shortage of semiconductor package substrates, we have received many requests from customers both in Japan and overseas to enter the package substrate business. We have decided that now is the best time to launch a new business in order to develop it into a pillar of our future business.
Q.
Please tell us about your efforts regarding build-up boards for automotive applications.
A.
Automotive substrates are our core business, and within this, demand for build-up substrates in particular is expanding. As we have a high production capacity for build-up substrates, including automotive substrates, we will review the content of our production in accordance with future demand.
