HDI PCB is composed of Staggered Via and Stacked Vias. Laser Via hole, IVH and Plated Through Hole are used in combination.
AnyLayer PCB with Laser Via and Filled Plating on each layer, it is possible to build thin construction and 0.4mm pitch CSP by AnyLayer interconnection.
Meiko has been developing a connection process using laser via and plating in addition to a bonding process using solder materials.
FPC (flexible printed circuits) is also known as a flexible PCB. It is excellent thinness, lightness, softness and durability using insulating film as a material.
FR4-FLEX/M-VIA Flex® is rigid-flex PCB without polyimide that can be utilized for applications that do not require repeated bending and as an alternative to connectors.
Multi-layer through-hole PCB is used for a wide variety of applications from special products to general usage.